Special Economic Measures (Russia) Regulations

Schedule 5.1 · Goods and Technologies — Export, Sell, Supply or Ship (Subsections 3.06(1) and (2))

1 In this Schedule, development, electronic assembly, energetic material, production, required, software and use have the same meaning as under the heading “Definitions of Terms Used in Groups 1 And 2” of A Guide to Canada’s Export Control List, published by the Department of Foreign Affairs, Trade and Development, as amended from time to time.2 This Schedule does not apply to goods or technologies that are subject to export control under the Export Control List, unless the good or technology is described in item 5400 of Group 5 of the schedule to that List. | Column 1 | Column 2Item | Goods and Technologies | Chemical Abstracts Service (CAS) Registry Number1, if applicable1 | Equipment, electronic assemblies and components, specially designed for quantum computers2, quantum electronics, quantum sensors, quantum processing units, qubit circuits, qubit devices3 or quantum radar systems. | 2 | Cryogenic refrigeration systems4 designed to maintain temperatures below 1.1 kelvin for 48 hours or more and cryogenic refrigeration equipment and components therefor, as follows: | (a)pulse tubes; | (b)cryostats; | (c)dewars; | (d)gas handling systems; | (e)compressors; and | (f)control units. | 3 | Ultra-high vacuum (UHV)5 equipment, as follows: | (a)UHV sublimation, turbomolecular, diffusion, cryogenic, or ion-getter pumps; and | (b)UHV pressure gauges. | 4 | High quantum efficiency photodetectors with a quantum efficiency greater than 80% in the wavelength range exceeding 300 nanometres but not exceeding 1700 nanometres. | 5 | Manufacturing equipment, as follows: | (a)additive manufacturing equipment for the production of metal parts, as follows: | (i)powder-bed systems using selective laser melting, laser cladding, direct metal laser sintering or electron beam melting, or | (ii)powder-fed systems using laser cladding, direct energy deposition or laser metal deposition; | (b)additive manufacturing equipment for energetic materials, including equipment using ultrasonic extrusion; and | (c)vat photopolymerization additive manufacturing equipment using stereo lithography or direct light processing. | 6 | Metal powders and metal alloy powders usable for the additive manufacturing equipment referred to in Item 5(a). | 7 | Microscopes, related equipment and detectors, as follows: | (a)scanning electron microscopes; | (b)scanning auger microscopes; | (c)transmission electron microscopes; | (d)atomic force microscopes; | (e)scanning force microscopes; and | (f)equipment and detectors specially designed for use with the microscopes referred to in paragraphs (a) to (e), employing any of the following: | (i)x-ray photo spectroscopy, | (ii)energy-dispersive x-ray spectroscopy, | (iii)electron back scatter detector systems, or | (iv)electron spectroscopy for chemical analysis. | 8 | Decapsulation6 equipment for semiconductor devices. | 9 | Software specially designed or modified for the development, production or use of the systems, equipment and components referred to in Items 1 to 8. | 10 | Software for digital twins of additive manufactured products or for the determination of the reliability of additive manufactured products. | 11 | Technology required for the development, production or use of the systems, equipment, components or software referred to in Items 1 to 10. | 12 | Equipment for oil production or oil exploration, as follows: | (a)drill heads with integrated measurement equipment and inertial navigation systems for measurement while drilling (MWD); | (b)gas monitoring systems and detectors therefor, designed for detection of hydrogen sulphide; | (c)equipment for seismological measurements, including reflection seismetics and seismic vibrators; and | (d)sediment echo sounders. | 13 | Collector equipment for metal ores in deep seabed. | 14 | Equipment for the production of printed electronics for organic light-emitting diodes (OLED), organic field-effect transistors (OFET) and organic photovoltaic cells (OPVC). | 15 | Equipment for the production of microelectromechanical systems (MEMS) using the mechanical properties of silicon, including sensors in chip format like pressure membranes, bending beams and micro adjustment devices. | 16 | Equipment specially designed for the production of e-fuels (electrofuels and synthetic fuels) or ultra-efficient solar cells (efficiency greater than 30%). | 17 | Numerically controlled machine tools having one or more linear axis with a travel length greater than 8 000 mm. | 18 | Advanced materials, as follows: | (a)materials for cloaking or adaptive camouflage; | (b)metamaterials, including with a negative refractive index; | (c)high entropy alloys (HEA); | (d)Heusler compounds; and | (e)Kitaev materials, including Kitaev spin liquids. | 19 | Conjugated polymers (conductive, semiconductive or electroluminescent) for printed or organic electronics. | 20 | Energetic materials and mixtures thereof, except where the material is incorporated in a medical product7, as follows: | (a)ammonium picrate; | 131-74-8(b)black powder; | (c)hexanitrodiphenylamine; | 131-73-7(d)difluoroamine; | 10405-27-3(e)nitrostarch; | 9056-38-6(f)tetranitronaphthalene; | (g)trinitroanisole; | (h)trinitronaphthalene; | (i)trinitroxylene; | (j)1-methyl-2-pyrrolidinone; | 872-50-4(k)dioctyl maleate; | 142-16-5(l)2-ethylhexyl acrylate; | 103-11-7(m)triethylaluminum (TEAL); trimethylaluminum and other pyrophoric metal alkyls and aryls of lithium, sodium, magnesium, zinc or boron; | 97-93-8; 75-24-1(n)nitroglycerin (or glycerol trinitrate; trinitroglycerin; NG); | 55-63-0(o)ethylenediamine, dinitrate (EDDN); | 20829-66-7(p)lead azide; lead styphnate; basic lead styphnate and primary explosives or priming compositions containing azides or azide complexes; | 13424-46-9; 15245-44-0; 12403-82-6(q)N,N'-diethyl-N,N'-diphenylurea; N,N'-dimethyl-N,N'diphenylurea; methylethyldiphenyl urea; | 85-98-3; 611-92-7(r)N,N-diphenylurea; | 603-54-3(s)methyl-N,N-diphenylurea (methyl unsymmetrical diphenylurea); | (t)N-methyl-N',N'-diphenylurea; N-ethyl-N',N'-diphenylurea; | 13114-72-2; 64544-71-4(u)4-nitrodiphenylamine; and | 836-30-6(v)2,2-dinitropropanol. | 918-52-521 | Technology required for the development, production or use of the systems, equipment, components and software specified in items 12-19. | 22 | Software specially designed or modified for the development, production or use of the systems, equipment and components specified in items 12-19. | 23 | Nettings, canopies, tents, blankets and apparel, specially designed for camouflage. | 24 | All-terrain vehicles.8 | 25 | Lithium and lithium compounds, as follows: | (a)lithium; | 7439-93-2(b)lithium carbonate; | 554-13-2(c)lithium hydroxide; lithium hydroxide, monohydrate | 1310-65-2; 1310-66-3(d)lithium oxide; | 12057-24-8(e)lithium cobalt oxide; | 12190-79-3(f)lithium iron phosphate; | 15365-14-7(g)lithium manganese oxide; | 12057-17-9(h)lithium nickel manganese cobalt oxide; and | 346417-97-8(i)lithium titanate. | 12031-82-226 | Ultra-high-molecular-weight polyethylene (UHMWPE) presented in any of the following forms: | (a)primary forms; | 9002-88-4(b)filament yarns or monofilaments; | (c)filament tows; | (d)rovings; | (e)staples or chopped fibres; | (f)fabrics including protective garments made from UHMWPE; and | (g)pulps or flocks. | 27 | Equipment for the manufacture of printed circuit boards (PCBs) and specially designed components and accessories therefor, as follows: | (a)film processing equipment; | (b)solder mask coating equipment; | (c)photo plotter equipment; | (d)plating or electroplating deposition equipment; | (e)vacuum chambers and presses; | (f)roll laminators; | (g)alignment equipment; and | (h)etching equipment. | 28 | Automated optical inspection equipment for testing printed circuit boards (PCBs), based on optical or electrical sensors and capable of detecting any of the following quality defects:(a)spacing, area, volume or height;(b)bill boarding;(c)components (presence, absence, flipped, offset, polarity or skew);(d)solder (bridging or insufficient solder joints);(e)leads (insufficient paste or lifting);(f)tombstoning; or(g)electrical (shorts, opens, resistance, capacitance, power or grid performance). | 29 | Printed circuit board (PCB) composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1,G-10, etc.). | 30 | Multilayer printed circuit board (PCB) substrates containing at least one layer of any of the following materials: | (a)aluminum; | (b)polytetrafluoroethylene (PTFE); or | (c)ceramic materials (e.g. alumina, titanium oxide, etc.). | 31 | Etchant chemicals, as follows9: | (a)ferric chloride; | 7705-08-0(b)cupric chloride; | 7447-39-4(c)ammonium persulphate; | 7727-54-0(d)sodium persulphate; and | 7775-27-1(e)chemical preparations specially designed for etching and containing any of the chemicals included in this item. | 32 | Copper foil with a minimum purity of 95% and of a thickness less than 100 μm (micrometres). | 33 | Polymeric substances and films thereof with a thickness of less than 0.5 mm, as follows: | (a)aromatic polyimides; | (b)parylenes; | (c)benzocyclobutenes (BCBs); and | (d)polybenzoxazoles. | 34 | Technology for the development, production or use of printed circuit boards (PCB). | 35 | Aromatic polyamides (aramids) presented in any of the following forms: | (a)primary forms; | (b)filament yarn or monofilaments; | (c)filament tows; | (d)rovings; | (e)staple or chopped fibres; | (f)fabrics including protective garments made from aromatic polyamide; or | (g)pulp or flocks. | 36 | Nanomaterials10, as follows: | (a)semiconductor nanomaterials; and | (b)composite-based nanomaterials. | 37 | Carbon-based nanomaterials, as follows: | (a)carbon nanotubes; | (b)carbon nanofibres; | (c)fullerenes; | (d)graphenes; and | (e)carbon onions. | 38 | Technology required for the development, production or use of the systems, equipment, components and software specified in the items above relating to aromatic polyamides, nanomaterials and carbon-based nanomaterials. | 39 | Rare earth metals11 and compounds that contain rare earth metals, in any form, including mixtures, whether or not intermixed or interalloyed12. | 40 | Tungsten, tungsten carbide and tungsten alloys, containing more than 90% tungsten by weight, in any form including scrap or waste.13 | 41 | Ceramic frequency filters. | 42 | Cermet trimmers. | 43 | Reciprocating or rotary internal combustion piston engines. | 44 | Electric motors. |